Carbon nanotube array as high impedance interconnects for sensing device integration

Dominique Baillargeat; Dunlin Tan; Chin Chong Yap; David Hee; Jongjen Yu; Jean-Luc Reverchon; Philippe Bois; Beng Kang Tay

Carbon nanotube array as high impedance interconnects for sensing device integration

Dominique Baillargeat ¹ Dunlin Tan ² Chin Chong Yap ³ David Hee ⁴ Jongjen Yu ⁴ Jean-Luc Reverchon ⁵ Philippe Bois ⁵ Beng Kang Tay ²

1 XLIM-MINACOM - MINACOM

XLIM - XLIM

2 CINTRA / SEEE Nanyang Technological University

3 SEEE Nanyang Technological University

CINTRA / SEEE Nanyang Technological University

4 THALES Singapore

5 3-5 Lab

Abstract : In next generation sensing architectures, compact systems that could enhance manoeuvrability and at the same time diversify sensing capability is similarly carried out through pitch size reduction to incorporate more pixels per unit area. This is because integration of these sensors to its Si read-out circuits has to be technologically compatible for proper signal digitization. In the case of metal interconnects, further down-scaling could lead to higher failure rate, mismatch in coefficient of thermal expansion. In this study, optical ...

Type de document :

Communication dans un congrès

Domaine :

Sciences de l'ingénieur [physics] / Micro et nanotechnologies/Microélectronique

Liste complète des métadonnées

https://hal-unilim.archives-ouvertes.fr/hal-00922154
Contributeur : Dominique Baillargeat <>
Soumis le : lundi 23 décembre 2013 - 21:56:59
Dernière modification le : jeudi 11 janvier 2018 - 06:26:39

Carbon nanotube array as high impedance interconnects for sensing device integration

Identifiants

Collections

Citation

Exporter

Métriques

124

Carbon nanotube array as high impedance interconnects for sensing device integration

Identifiants

Collections

Citation

Exporter

Partager

Métriques

124