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Communication dans un congrès
Carbon nanotube array as high impedance interconnects for sensing device integration
Abstract : In next generation sensing architectures, compact systems that could enhance manoeuvrability and at the same time diversify sensing capability is similarly carried out through pitch size reduction to incorporate more pixels per unit area. This is because integration of these sensors to its Si read-out circuits has to be technologically compatible for proper signal digitization. In the case of metal interconnects, further down-scaling could lead to higher failure rate, mismatch in coefficient of thermal expansion. In this study, optical ...
https://hal-unilim.archives-ouvertes.fr/hal-00922154
Contributeur : Dominique Baillargeat Connectez-vous pour contacter le contributeur
Soumis le : lundi 23 décembre 2013 - 21:56:59
Dernière modification le : mercredi 22 décembre 2021 - 11:58:03
Contributeur : Dominique Baillargeat Connectez-vous pour contacter le contributeur
Soumis le : lundi 23 décembre 2013 - 21:56:59
Dernière modification le : mercredi 22 décembre 2021 - 11:58:03
