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Communication Dans Un Congrès Année : 2013

Carbon nanotube array as high impedance interconnects for sensing device integration

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Résumé

In next generation sensing architectures, compact systems that could enhance manoeuvrability and at the same time diversify sensing capability is similarly carried out through pitch size reduction to incorporate more pixels per unit area. This is because integration of these sensors to its Si read-out circuits has to be technologically compatible for proper signal digitization. In the case of metal interconnects, further down-scaling could lead to higher failure rate, mismatch in coefficient of thermal expansion. In this study, optical ...
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Dates et versions

hal-00922154 , version 1 (23-12-2013)

Identifiants

  • HAL Id : hal-00922154 , version 1

Citer

Dominique Baillargeat, Dunlin Tan, Chin Chong Yap, David Hee, Jongjen Yu, et al.. Carbon nanotube array as high impedance interconnects for sensing device integration. Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, May 2013, United States. pp.154-158. ⟨hal-00922154⟩

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