Carbon nanotube array as high impedance interconnects for sensing device integration

Abstract : In next generation sensing architectures, compact systems that could enhance manoeuvrability and at the same time diversify sensing capability is similarly carried out through pitch size reduction to incorporate more pixels per unit area. This is because integration of these sensors to its Si read-out circuits has to be technologically compatible for proper signal digitization. In the case of metal interconnects, further down-scaling could lead to higher failure rate, mismatch in coefficient of thermal expansion. In this study, optical ...
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https://hal-unilim.archives-ouvertes.fr/hal-00922154
Contributeur : Dominique Baillargeat <>
Soumis le : lundi 23 décembre 2013 - 21:56:59
Dernière modification le : jeudi 11 janvier 2018 - 06:26:39

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  • HAL Id : hal-00922154, version 1

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Dominique Baillargeat, Dunlin Tan, Chin Chong Yap, David Hee, Jongjen Yu, et al.. Carbon nanotube array as high impedance interconnects for sensing device integration. Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, May 2013, United States. pp.154-158. ⟨hal-00922154⟩

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