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Communication Dans Un Congrès Année : 2012

Carbon based multi-functional materials towards 3D system integration. Application to thermal and interconnect management

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hal-00922179 , version 1 (23-12-2013)

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  • HAL Id : hal-00922179 , version 1

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Dominique Baillargeat, Wl Chow, Cc Yap, D. Tan, M. Shakerzadeh, et al.. Carbon based multi-functional materials towards 3D system integration. Application to thermal and interconnect management. Microwave Symposium Digest (MTT), 2012 IEEE MTT-S International, Jun 2012, France. pp.1-3. ⟨hal-00922179⟩

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