Electrical Properties of Flip Chip Bonding Using Carbon Nanotube Bundles for Rf Applications - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année :

Electrical Properties of Flip Chip Bonding Using Carbon Nanotube Bundles for Rf Applications

Fichier non déposé

Dates et versions

hal-00922468 , version 1 (26-12-2013)

Identifiants

  • HAL Id : hal-00922468 , version 1

Citer

Dominique Baillargeat, Christophe Brun, Ching Chong Yap, Beng Kang Tay, Tan D. Electrical Properties of Flip Chip Bonding Using Carbon Nanotube Bundles for Rf Applications. International Conference of Young Researchers on Advanced Materials (ICYRAM), Jun 2012, Singapore. ⟨hal-00922468⟩

Collections

UNILIM CNRS XLIM
24 Consultations
0 Téléchargements

Partager

Gmail Facebook Twitter LinkedIn More