Improving the Performance of CNT to CNT Bumps for Flip Chip Applications - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2013

Improving the Performance of CNT to CNT Bumps for Flip Chip Applications

(1) , (2) , (2) , (1) , (3) , (3) , (2)
1
2
3
Fichier non déposé

Dates et versions

hal-00922471 , version 1 (26-12-2013)

Identifiants

  • HAL Id : hal-00922471 , version 1

Citer

Dominique Baillargeat, Chin Chong Yap, Dunlin Tan, Christophe Brun, Jun Wei, et al.. Improving the Performance of CNT to CNT Bumps for Flip Chip Applications. International Conference on Material for Advanced Technologies, ICMAT 2013, Jun 2013, Singapore. ⟨hal-00922471⟩

Collections

UNILIM CNRS XLIM
56 Consultations
0 Téléchargements

Partager

Gmail Facebook Twitter LinkedIn More