Accéder directement au contenu Accéder directement à la navigation
Article dans une revue

Use of a thermal plasma process to recycle silicon kerf loss to solar-grade silicon feedstock

M. de Sousa 1 Armelle Vardelle 1 Gilles Mariaux 1 Michel Vardelle 1 U. Michon 2 V. Beudin 2
1 SPCTS-AXE2 - Axe 2 : procédés plasmas et lasers
SPCTS - Science des Procédés Céramiques et de Traitements de Surface
Abstract : The objective of this study was to recycle the dust generated in the slicing of silicon wafers (silicon kerf) by means of a two-stage thermal plasma process. In the first stage, the silicon particles are injected in a plasma jet where silicon oxides and carbon impurities are removed by vaporization. In the second stage, the purified silicon droplets are collected in a silicon bath maintained in a hot-wall crucible. The optimal operating conditions for reduction were determined by injecting into the plasma jet a commercial silicon powder of known degree of oxidation and measuring the attained degree of reduction. Also, silicon powders from wafer slicing were processed in the two-stage plasma set-up. The results of these tests showed that the deoxidation rate of the final silicon ingot was as high as 80% and the initial carbon concentration decreased by 85%. The purification was essentially controlled by the residence time of particles in the hottest zones of the plasma jet and the partial pressure of oxygen in the processing atmosphere.
Type de document :
Article dans une revue
Liste complète des métadonnées
Contributeur : Beatrice Derory <>
Soumis le : lundi 17 septembre 2018 - 14:06:26
Dernière modification le : mardi 18 septembre 2018 - 01:14:31




M. de Sousa, Armelle Vardelle, Gilles Mariaux, Michel Vardelle, U. Michon, et al.. Use of a thermal plasma process to recycle silicon kerf loss to solar-grade silicon feedstock. Separation and Purification Technology, Elsevier, 2016, 161, pp.187 - 192. ⟨10.1016/j.seppur.2016.02.005⟩. ⟨hal-01875458⟩



Consultations de la notice