Carbon nanostructures based RF nanopackaging: Application to 3D interconnect

Beng Kang Tay (1) , Dominique Baillargeat (2) , Philippe Coquet (3) , Stéphane Bila (2)

1 EEE - School of Electrical and Electronic Engineering
2 XLIM-SRF - Systèmes RF
3 IEMN - Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520

Domaines: Sciences de l'ingénieur [physics]; Electronique

Beng Kang Tay, Dominique Baillargeat, Philippe Coquet, Stéphane Bila. Carbon nanostructures based RF nanopackaging: Application to 3D interconnect. IEEE MTT-S International Microwave Symposium (IMS 2015), Jun 2015, Phoenix, United States. ⟨hal-01290990⟩